Fig. 2: Comparison of mechanical properties.
From: Superelastic alloy based electrical interconnects for highly stretchable electronics
a Schematic illustration of the formation process of the Ni-Ti serpentine interconnects by mold. b Diagram of the heat treatment for setting the Ni-Ti wires into serpentine interconnects. c A comparison of elastic stretchability between Cu and Ni-Ti serpentine interconnects. The right column shows the interconnect structures after releasing 100% applied strain. The scale bar is 2 mm.
