Fig. 5: Discussion of FEA simulation results. | npj Flexible Electronics

Fig. 5: Discussion of FEA simulation results.

From: Superelastic alloy based electrical interconnects for highly stretchable electronics

Fig. 5

a Dependence of the maximum principal strain, εmax, (on the material level) on the applied strain, εapp, (on the structure level). b FEA simulation of the martensite volume fraction distribution under the applied tensile strain of 185%. c Magnified view of modeling results for the part of the interconnect structures that experience the highest strain.

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