Fig. 2: Simulation of thermal induced stress of different ground contact approaches. | npj Flexible Electronics

Fig. 2: Simulation of thermal induced stress of different ground contact approaches.

From: Bringing sensation to prosthetic hands—chronic assessment of implanted thin-film electrodes in humans

Fig. 2

a The rectangular ground contact site (1 mm × 0.25 mm) was used on the TIME-3H within a subchronical trial33. Simulated stress values were acquired close to the edge of the PI (grey line) and in the middle of the contact (dashed line). b The split ground with 109 single redundant connected contact sites (diameter of single contact 80 µm) was designed for chronic application. c Simulated stress values were acquired in the middle of the device on a length of 1 mm. Several standard parameters of the simulation software for the thermo-mechanical stress simulation of various ground contact sites were changed.

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