Fig. 15: LM-based exoskeleton devices and e-skins.

a The top view of the flexible mechanical exoskeleton195. b Comparison of mechanical strength between conventional paraffin-based mechanical joints and that based on low melting point alloy195. a, b Copyright 2014, American Society of Mechanical Engineers. c The temperature changes of TE-skin under various airflows, where the temperature of the film heater is 40 °C205. d, e A bracket was charged by TE-skin on the human arm205. f, g A cellphone was dialed by the TE-skin205. c–g Copyright 2024, John Wiley and Sons.