Fig. 3: Soft transfer technology.
a Schematic diagram of the large-scale transfer of MoS2 arrays by the thermal release transfer technology80. b Schematic diagram of the circuit array formed the thermal release transfer technology80. c Schematic of the process of adjusting the contact area between the stamp interface and the device with a laser to release the material83. d Optical images of different patterned objects transferred by Laser-driven non-contact transfer technology83. Scale bar: 200 μm. e Schematic diagram of the working principle of the bioinspired adhesive structure with controllable weak and strong adhesion modes84. f SEM image of resin plates which transferred by bioinspired adhesive structure84. Scale bar: 20 μm. g Schematic diagram of picking up and transferring a micro-nano device onto a receiving substrate by using a shape memory polymer (SMP)162. h Transferring micro-LEDs with SMP, the micro-LEDs remain illuminated after the transfer162. i Schematic representation of the surface chemistry and adhesion transfer technique, and finally the release of the device by utilizing the etching of the sacrificial layer85. j Capacitors transferred to the tape85.
