Table 1 Comparative analysis of traditional electronic fabrication technology and advanced flexible electronics fabrication technologies

From: Revolutionizing wearable technology: advanced fabrication techniques for body-conformable electronics

Technology

Classification

Approximate resolution

Applications

Efficiency

Durability

Cost

Ref.

Traditional electronic fabrication technology

-

3 nm–μm

Integrated circuit, print circuit board, etc.

Low

High

High

-

Printed electronics fabrication technology

Spray coating

30–100 μm56

Flexible sensors177, flexible displays60, flexible circuit59, etc.

Minutes

Moderate

Low

56,59,60,177

Screen printing

20–100 μm65

Flexible solar cells68, flexible displays65, flexible circuit69, etc.

Minutes

Moderate

65,68,69

Roll-to-roll technology

1 μm152

Flexible solar cells76, flexible displays73, flexible batteries74, flexible circuit71, etc.

Minutes–hours

High

71,73,74,76,152

Soft transfer technology

Soft transfer

Thermal release transfer 60 nm178

Flexible displays79, integrated circuit80, etc.

Minutes

Moderate

Moderate

48,79,80,83,85,162,178

 

Laser-driven non-contact transfer 10–100 μm83

  

High

 
 

Shear-assisted transfer 50 nm48

  

Low

 
 

Shape memory material transfer 10 μm162

  

High

 
 

Surface chemical and adhesive transfer 50 nm85

  

High

 

3D structures fabrication technology

Soft lithography

μCP 100 nm92

Flexible circuit88, flexible displays89, biosensor179, etc.

Minutes–hours

High

Moderate

87,88,89,92,95,179,180

 

μTM 350 nm87

  

High

 
 

MIMIC 200 nm–5 μm180

  

High

 
 

SAMIM 1 μm95

  

Moderate

 

3D printing

SLA 100 nm (m-SLA)96

Flexible circuit112, flexible sensors106, soft robotics96, implantable devices105, microfluidics181, etc.

Minutes–hours

High

96,104,105,106,112,181,182

 

DLP 50 μm104

  

High

 
 

FDM 100 μm182

  

Low

 
 

DIW 75 μm112

  

Low

 

Fiber/fabric technology

Thermal drawing 50 μm–1 mm183

Flexible circuit119, flexible sensor184, biomedical185, etc.

Minutes–hours

Low

119,183,184,185,186

 

Electrospinning 3 nm–5 μm186

  

Moderate

 

Deformation fabrication technology

Kirigami technology

50 nm187

Flexible sensors133, flexible electrode136, implantable devices138, etc.

Minutes

High

Low

133,136,187

Mechanically guided assembly technology

10 nm144

Flexible sensors130, soft robotics10, flexible circuit141, etc.

Minutes

Low

10,130,141,144