Fig. 4: Electrochemical and mechanical analysis of MEA for 80-μm-height μETF. | npj Flexible Electronics

Fig. 4: Electrochemical and mechanical analysis of MEA for 80-μm-height μETF.

From: Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces

Fig. 4

Comparison of a EIS magnitude and b phase at 1 kHz, and c CSCC of gold and IrOx electrodes before and after 80-μm μETF. Box plots represent the median and 50% range. d Mechanical resilience of 80-μm-protruding μETF MEA during three cycles of full compression and relaxation. e Magnified view showing μETF structures compressed by 2.2 μm under 2.2 kPa load of normal physiological pressures within an intraocular and intracranial environment. f Variation of impedance magnitude of μETF MEA at frequencies of 10 Hz, 1 kHz, and 100 kHz during and after 50 cycles of repeated compression at 25 kPa.

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