Fig. 6: Temperature and stress profiles obtained through High Frequency XRD. | npj Materials Degradation

Fig. 6: Temperature and stress profiles obtained through High Frequency XRD.

From: Intragranular strain and mosaicity in Cu thin films during fast thermomechanical fatigue

Fig. 6

Displayed are the temperature (a) and stress (b) derived from the high-frequency XRD measurements. The temperature pulses ranged from 100–400 °C and differed only in their pulse length between 200 µs and 20 ms. The maximum stresses observed were −201 ± 22 MPa and −293 ± 18 MPa for the shorter and longer pulse lengths, respectively.

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