Fig. 1: Schematics (not to scale) illustrating the multi-core architecture.

a Isometric view of the device assembly. The qubits (blue circular structures) are fabricated on the QuIC die and have one arm with a paddle-shaped coupler extending to the edge of the chip. The chips are flip-chip bonded onto the carrier chip using indium bump bonds (yellow) and the qubit couplers are aligned above couplers on the carrier chip (teal) as shown in the inset as well as the cross-sectional view. b False-colored schematic of a single QuIC including readout resonators and readout lines (magenta and green), indium bumps (yellow), flux bias lines (orange) and the qubits and paddles of the inter-chip couplers (blue). The physical qubits are labelled 0–7 while Roman numerals correspond to the design specification for the qubit (see Methods). Note that component geometries are not drawn exactly as fabricated: the schematic is intended primarily to depict the circuit layout as opposed to details into individual feature geometries.