Extended Data Fig. 1: Photographs and schematics illustrating the processes of brain resection surgery and VasES implantation. | Nature Biomedical Engineering

Extended Data Fig. 1: Photographs and schematics illustrating the processes of brain resection surgery and VasES implantation.

From: Laminin-coated electronic scaffolds with vascular topography for tracking and promoting the migration of brain cells after injury

Extended Data Fig. 1

In each panel, I, II and III show photographs, top view schematics and side view schematics, respectively. a, Generate a cranial window centered at bregma with a lateral dimension of 4 mm (mediolateral) by 2 mm (anteroposterior). b, Resect cortical tissue to the depth of 1 mm in each hemisphere, leaving behind the resection cavity and intact margins of dura. c, Fill the resection with Matrigel and let it sit for 10–15 min to solidify. d, Stereotaxically implant VasES throughout the cortical resection, remaining cortical tissue and SVZ. Bond the input-output interface of electronics to flat flexible cable for electrophysiology recording. e, Seal the cranial window with agarose, silicone adhesive and dental cement sequentially. Scale bars, 2 mm.

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