Extended Data Fig. 4: Experimental setup and in situ tensile fracture test of a ntDC NB in TEM.

a, Photograph of the stretched chip structure based on Bestron double tilt tensile holder. In situ transmission stretching sample is fixed at the position marked by the red circle. b, Low-magnification TEM image of the sample prepared by FIB technology for in situ tensile fracture test in TEM. c to e, TEM images of the NB at moments of before fracture, after fracture, and before recovery, respectively, insets in c and e are SAED patterns taken from the corresponding white circled regions. f, High-resolution TEM image from the boxed region in e just before the recovery of the two fracture ends. Regions of diamond and DOs are labeled. g and h, Atomic-resolution high-resolution TEM images from the blue and yellow boxes in f, respectively, detailing the graphite-like layers at the fracture surfaces.