Extended Data Fig. 7: Schematic of the workflow of the TEM cross-sectional sample preparation using focused ion beam.
From: Freestanding crystalline oxide perovskites down to the monolayer limit
a, Deposition of a Pt protection layer on the film surface by electron beam evaporation. b, Etching by gallium ion beam to form a sample lamella. c, Cutting off the lamella by gallium ion beam and pulling it out by in situ micro-manipulator. d, Adjusting the lamella position. e, Transfer of the lamella to a sample grid and detaching of the micro-manipulator. f, Thinning of the lamella to be electron-transparent and removing the superficial amorphous layers by ion-beam fine milling and polishing.
