Extended Data Fig. 1: Electro-mechanical performance of soft modules connected by conventional pastes or BIND interfaces.

a-d, Schematic (a) and photographs (b-d) of two soft PDMS/Au modules connected using commercial ACF. Stress concentration at connection region results in electrical failure at 50% strain (b, c) and mechanical failure at 76% strain (d). e-h, Schematic (e) and photographs (f-h) of two BIND interfaces connected without any pastes display conductivity up to 180% strain (f, g) and remain connected even at > 600% strain (h). i, Unlike connections using commercial pastes, BIND connection remained conductive (as shown by the low resistance change) even at 180% strain (left). Magnified graph of the low strain region (0–50%) on the right shows BIND connection experienced < 4 times change in relative resistance at 50% strain.