Extended Data Fig. 2: MEMS Fabrication process.
From: On-chip multi-degree-of-freedom control of two-dimensional materials
(a) Thermal silicon dioxide is grown on a commercial SOI wafer. (b) Back-side oxide patterning. (c) Tip KOH etching and oxide removal. (d) TSV etching and coating. (e) Back-side and front-side RIE etching and vapour HF release. (f) Bonding to bottom substrate. Blue: Silicon. Gray: Silicon oxide. Orange: Poly-silicon. Yellow: SU-8.
