Extended Data Fig. 2: JJ area estimation.
From: Advanced CMOS manufacturing of superconducting qubits on 300 mm wafers
a, SEM image of a JJ after BE patterning. b, SEM image of a JJ after TE patterning. c, TEM image of a cross section of a JJ, including an ellipse circumference as approximation of the rounded BE surface. d, Average width of the JJ’s BE and TE measured from the SEM images a,b. The solid lines are linear fits including a constant offset. e, Best effort estimate of the JJ area, calculated for each designed JJ critical dimension.
