Figure 3
From: Microchannel contacting of crystalline silicon solar cells
Electroless plating within the microchannel. (a) Nickel electroless plating procedure used in this study, for steps i-iii a top-view optical microscope image is provided, and for step iv a cross sectional SEM image with accompanying EDX mapping of local Ag, Ni and Si concentration is included. (b) Contact resistivity extraction of Ni plated layer on n++ (top) and p+(bottom) surfaces. Planar heterojunction solar cell (c) layer design; and (d) 1 sun JV results.
