Figure 1 | Scientific Reports

Figure 1

From: Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate

Figure 1

Low magnification TEM images and high resolution TEM images of In–Sn (a) and In–Sn–Bi nanoparticles (b), and 0.6MWCNT/In–Sn–Bi (c and d) and 1.2MWCNT/In–Sn–Bi composite nanostructures (e and f). High-resolution images of the tetragonal In3Sn (d) and BiIn (f) phases showing their (1 1 1) planes. The solder nanoparticles present a spherical shape, while the composite nanostructures exhibit the tubular shape of the MWCNTs embedded within the irregular shapes of the nanoparticles, which provided improvements in the solder’s electrical and thermo-mechanical properties.

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