Figure 3 | Scientific Reports

Figure 3

From: Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate

Figure 3

In–Sn–Bi nanoparticles are patterned on the PET substrate using a roll-to-plate printer (a and b) and reflowed at 110 °C. Two types of solder bumps printed patterns: (b) pad type on the left-hand side and dot and wedge type on the right-hand side. Feasibility test of In–Sn–Bi nanoparticles before (c and e) and after (d and f) reflow. The conventional solder bumps have low wettability on the PET substrate and broadly dispersed side bumps near the main core bump due to relatively low diffusivity among the solder nanoparticles.

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