Figure 5

(a) XRD patterns of reduced MWCNTs, In–Sn and In–Sn–Bi nanoparticles, and 0.6MWCNT/In–Sn–Bi and 1.2MWCNT/In–Sn–Bi composite nanostructures. (b–f) XPS results of 0.6MWCNT/In–Sn–Bi composite nanostructures for a survey scan (b), C (c), In (d), Sn (e), and Bi (f). For the composite solder nanostructures, the presence of MWCNTs is ambiguous in the XRD analysis but clear in the XPS analysis, which also revealed no damage on the surface of the carbon nanotubes. The electrical and thermo-mechanical properties of the composite solder were improved.