Figure 2

(a) Fabrication process of Au microhole arrays. Step I: applying EBL to write patterns in ZEP520 on Ge. Step II: depositing an 80 nm-thick Au film via electron beam evaporation. Step III: using acetone to pattern Au film. Step IV: sputter a 160 nm-thick Ge layer on the top of metal. (b) Overview micrograph of Au microhole arrays. (c) A close-up SEM image of the fabricated Au microhole array on Ge wafer.