Table 1 The parameters of MEMS multi-layer cantilever beam.
From: Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process
Material | Young’s modulus (GPa) | Thermal expansion coefficient (10−6/°C) | Poisson’s ratio | Thickness (μm) | Length/Width |
|---|---|---|---|---|---|
Al | 70 | 25 | 0.33 | 0.5–5 μm | 300–500 μm/500 μm |
Si3N4 | 385 | 0.8 | 0.28 | 0.1 μm | 300–500 μm/500 μm |
SiO2 | 73 | 0.55 | 0.17 | 0.3 μm | 300–500 μm/500 μm |
Si | 165 | 2.33 | 0.33 | 3–20 μm | 300–500 μm/500 μm |
