Table 1 Variations of fabrication techniques developed for the manufacturing of μPADs.
Fabrication method | Hydrophobic agent | Achieved resolution | Paper type | References |
|---|---|---|---|---|
Laser treatment | Silicone coating | 62 ± 1 μm | Parchment paper | |
Pen plotting | Hydrophobic ink | 150 ± 12 μm | Whatman No. 1 | |
Photolithography | SU-8 | 186 ± 13 μm | Chromatography paper | |
Screen-printing | Rubber latex | 256 ± 21 μm | Paper towel | |
540 ± 70 μm | Whatman No. 4 | |||
780 ± 98.5 μm | Whatman No. 1 | |||
Varnishing paint | 500 μm | |||
PDMS | 650 μm | |||
Wax | 650 ± 71 μm | |||
Polystyrene | 671 ± 51 μm | Whatman No. 4 | ||
PMMA | 1000 μm | |||
Inkjet printing | UV curable acrylate ink | 272 ± 19 μm | Advantec No. 5C | |
Chemical treatment | Wax (μPAD submerged in NaIO4) | 301 μm | Whatman No. 1 | |
Flexography printing | Hydrophobic ink | 500 μm | ||
Inkjet etching | Polystyrene | 550 μm | Advantec No. 2 | |
Wax dipping | Wax | 639 ± 7 μm | Whatman No. 1 | |
3D pen drawing | Acrylic resin | 2000 μm | Whatman No. 1 | |
UV light curing | Water-based polyurethane acrylate | 200 μm | Whatman No. 1 |
