Figure 10
From: Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
Chemical formulas of SH110 and SPS used in this study. (a) SH110; acidic form, (b) SH110; sodium salt, (c) 4,5-dihydrothiazole (DHT), (d) SPS; acidic form, (e) SPS; sodium salt, and (f) 3-mercaptopropane sulfonate (MPS).
