Figure 3
From: Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
LSV measured in the plating bath. (a) Plating solution with SH110 and (b) plating solution with SPS.
Figure 3 | Scientific Reports
From: Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
LSV measured in the plating bath. (a) Plating solution with SH110 and (b) plating solution with SPS.
