Figure 5
From: Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
Configuration of SH110 adsorbed on Cu (001), Cu (101) and Cu (111) surface. (a) Side view of initial stage on Cu (111), (b) side view of equilibrium stage on Cu (001) surface (c) side view of equilibrium stage on Cu (101) surface. (d) side view of equilibrium stage on Cu (101) surface (
https://www.3ds.com/products-services/biovia/ material studio 6.0).
