Figure 3 | Scientific Reports

Figure 3

From: Simultaneous strength and ductility enhancements of high thermal conductive Ag7.5Cu alloy by selective laser melting

Figure 3

(a) Scheil-Gulliver solidification curves of Ti8.5Cu, Ti7.5Cu, Ag8.5Cu and Ag7.5Cu. (b) Thermal conductivity of Ti8.5Cu and Ag7.5Cu during solidification. (c) Cooling curves of Ti8.5Cu and Ag7.5Cu during solidification. All the three figures (a–c) are obtained from JMatPro 7.0.0 software54. (d) An EBSD-IPF map of ultrafine equiaxed grains. (e) Grain size distribution based on the EBSD-IPF map.

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