Table 2 Cutting conditions for analyzing the cutting signals according to depth of cut when cutting depth was 71.425 μm in machining of micro triangular pyramid pattern.

From: Investigation of ultra-precision planing process to fabricate high luminance retroreflector based on cutting force and tool vibration analysis

Machine tools

4-axis ultra-precision planar of X, Y, Z and theta-axis

(Movement resolution of 5 nm and rotation resolution of 0.0001°)

Cutting tool

Single crystal diamond with sharp edge of 70.5°

(rake angle of 0° and cutting edge radius of 114 nm)

Workpiece

Cu-plated on the SKD 11 with size of 30 × 30 mm

(Vickers Hardness 227.8)

Cutting speed (mm/sec)

200

Depth of cut (µm)

3, 2, 1, 0.5, 0.3, 0.1

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