Table 1 The quality characteristics and specifications for driver IC.
From: Product quality evaluation by confidence intervals of process yield index
Mold thickness | 0.25 mm | ||
|---|---|---|---|
Item | Layers | µm | Tolerance (µm) |
A | Top Space | 95 | 10 |
B | Top Loop | 55 | 15 |
C | Die | 70 | 5 |
D | Film | 30 | 5 |
E | Mold thickness | 250 | 50 |
F | Substrate thickness | 110 | 25 |
