Table 4 Comparison of mechanical properties and electrical conductivity of pure copper as described in this work with combinations of other processes presented in the professional literature.

From: Effect of microstructure refinement of pure copper on improving the performance of electrodes in electro discharge machining (EDM)

Material

Processing

Sample size

True strain

Grain size, d2 (nm)

UTS (MPa)

YS (MPa)

HV 0.2

IACS (%)

References

Cu 99.7%

CBD(1)

210 µm

7.2

145

790

680

68.5

38

Cu 98.5%

ARB(2)

30 × 1 mm (wide x thickness)

50%

180

723

185

-

39

Cu 99.96%

ECAP(3)

10 mm

16

440

419.24

385

95.35

40

Cu 99.44%

ECAP + rolling

25 × 2 mm (wide x thickness)

610

320

112

81

41

Cu 99.96%

ECAP

10 mm

16

500

94.3

42

Cu 99.99%

ECAP

20 mm

4.62

388

331

43

Cu 99.97%

ECAP

10 mm

8

470

371

361

44

Cu 99.81%

ECAP

10 mm

8

520

361

343

44

Cu 99.95%

ECAP

10 × 10

12

440

125

45

Cu 99.95%

HE

10 mm

3.89

228

464

456

123

97.05

This work

  1. (1)Continuous Bending-Drawing (CBD), (2)Accumulative Roll-Bonding (ARB), (3)Equal Chanell Angular Pressing (ECAP).