Table 3 SCAPS simulation parameters for different HTLs.
Parameter | Cu2O32 | CuO34 | CuI32 | CuSCN33 |
---|---|---|---|---|
Thickness (µm) | 0.050 | 0.050 | 0.050 | 0.050 |
Band gap (eV) | 2.17 | 1.51 | 3.1 | 3.4 |
Electron affinity (eV) | 3.2 | 4.07 | 2.1 | 1.9 |
Dielectric permittivity (relative) | 7.11 | 18.1 | 6.5 | 10.0 |
CB (conduction band) effective density of states (cm−3) | 2.02 × 1017 | 2.2 × 1019 | 2.8 × 1019 | 2.2 × 1018 |
VB (valence band) effective density of states (cm−3) | 1.1 × 1019 | 5.5 × 1020 | 1.0 × 1019 | 1.8 × 1018 |
Electron mobility (cm2/V s) | 2.0 × 102 | 1.0 × 101 | 1.0 × 102 | 1.0 × 102 |
Hole mobility (cm2/V s) | 8.0 × 101 | 1.0 × 10–1 | 4.39 × 101 | 2.50 × 101 |
Electron thermal velocity (cm/s) | 1.0 × 107 | 1.0 × 107 | 1.0 × 107 | 1.0 × 107 |
Hole thermal velocity (cm/s) | 1.0 × 107 | 1.0 × 107 | 1.0 × 107 | 1.0 × 107 |
Shallow uniform donor density (ND) cm−3 | 0 | 0 | 0 | 0 |
Shallow uniform acceptor density (NA) cm−3 | 1.0 × 1019 | 1.0 × 1018 | 1.0 × 1018 | 1.0 × 1018 |
Total defect density (Nt) cm−3 | 1.0 × 1015 | 1.0 × 1015 | 1.0 × 1015 | 1.0 × 1015 |