Figure 1 | Scientific Reports

Figure 1

From: Engineering the structural and electrical interplay of nanostructured Au resistive switching networks by controlling the forming process

Figure 1

(a) Schematic representation (not to scale) of the apparatus for the deposition of cluster-assembled Au films. It consists of a pulsed micro-plasma cluster source (PMCS) mounted on the axis of differentially pumped vacuum chambers; the PMCS produces a supersonic expansion of an inert gas seeded with metallic clusters to form a cluster beam. The beam is intercepted by a substrate placed on a mobile holder (manipulator) in the deposition chamber. Substrates with gold electrodes, previously deposited by thermal evaporation, are mounted on the sample holder and intercept the cluster beam passing through a mask allowing the deposition of stripe of gold cluster-assembled film connecting each pair of electrodes, as it is schematically shown in (b). A quartz microbalance attached to the manipulator is periodically exposed to the cluster beam to monitor the amount of deposited material. In situ electrical characterization during the cluster-assembled film growth is performed.

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