Figure 2
From: Time-bin entanglement at telecom wavelengths from a hybrid photonic integrated circuit
Assembly process and photograph of the hybrid PIC. First, the PolyBoard is prepared by inserting the thin-film long-pass filter (LP) and polarizing beam splitter (PBS) in their pre-etched slots (a), installing the output fibers (b), optimizing all elements for transmission and securing them with UV-curing, index-matched adhesive (c). Next, using active alignment, the BRW is end-facet coupled to the PolyBoard and the interface secured with adhesive once the transmission is optimized (d). Finally, the newly formed hybrid PIC is mechanically stabilized by a common silicon mount with 7x10 mm footprint (e). A photograph (reprinted with permission from50) of the final assembly used in this work (f).
