Table 1 Process parameters and level settings.
From: Molecular dynamics simulation of hybrid structure and mechanical properties of DLC/Ni-DLC thin films
Water flat | Sputtering temperature(K) | Sputtering voltage(V) | Deposition air pressure (Pa) |
|---|---|---|---|
1 | 348.15 | 300 | 0.2 |
2 | 423.15 | 400 | 0.7 |
3 | 498.15 | 500 | 1.2 |
4 | 573.15 | 600 | 1.7 |
