Table 2 MD simulation results of orthogonal experimental DLC films.

Number	Sputtering temperature/K	Sputtering voltage/V	Deposition air pressure/Pa		Sp³			Residual stress/Gpa	Film base bonding/N
1	348.15	300	0.2	0.3865	0.0387	0.4235	17.96	0.108	33.72
2	348.15	400	0.7	0.3284	0.06661	0.4438	21.17	1.363	33.03
3	348.15	500	1.2	0.2674	0.09553	0.47499	22.66	1.788	34.41
4	348.15	600	1.7	0.2736	0.09240	0.45462	20.33	1.749	34.22
5	423.15	300	0.7	0.3228	0.05201	0.46066	18.44	1.274	31.63
6	423.15	400	0.2	0.2561	0.10488	0.46802	21.30	5.003	34.35
7	423.15	500	1.7	0.3288	0.06087	0.45378	20.54	-0.504	32.17
8	423.15	600	1.2	0.2861	0.08849	0.47773	19.32	1.658	32.91
9	498.15	300	1.2	0.3627	0.04616	0.45631	18.18	0.612	33.23
10	498.15	400	1.7	0.2829	0.09403	0.46329	19.82	1.628	33.93
11	498.15	500	0.2	0.2387	0.11108	0.48876	18.84	2.079	33.97
12	498.15	600	0.7	0.2633	0.10500	0.48405	21.28	2.667	32.36
13	573.15	300	1.7	0.2811	0.09330	0.46412	20.64	1.645	32.98
14	573.15	400	1.2	0.3935	0.03508	0.41681	19.01	0.195	34.30
15	573.15	500	0.7	0.2993	0.09104	0.44658	18.82	2.576	33.45
16	573.15	600	0.2	0.2918	0.08433	0.44896	17.88	2.178	34.09

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