Table 3 MD simulation results of orthogonal experimental Ni-DLC films.

Number	Sputtering temperature/K	Sputtering voltage/V	Deposition air pressure/Pa		Sp³	Sp²/Sp³	Film thickness/Å	Residual stress/Gpa	Film base bonding/N
1	348.15	300	0.2	0.2837	0.1465	0.5170	36.87	−0.969	38.54
2	348.15	400	0.7	0.2736	0.1995	0.3460	34.03	0.065	44.80
3	348.15	500	1.2	0.2263	0.2266	0.3791	34.69	−0.244	44.75
4	348.15	600	1.7	0.2331	0.2167	0.3849	34.47	−0.103	44.79
5	423.15	300	0.7	0.2491	0.1937	0.3927	37.09	−0.010	44.82
6	423.15	400	0.2	0.2362	0.2001	0.3936	36.33	−1.002	44.55
7	423.15	500	1.7	0.2297	0.2265	0.3765	37.89	−0.133	44.63
8	423.15	600	1.2	0.2327	0.2104	0.3861	35.70	−0.322	44.87
9	498.15	300	1.2	0.2365	0.2066	0.3896	35.43	−0.383	44.67
10	498.15	400	1.7	0.2328	0.2157	0.3830	36.41	−0.073	44.82
11	498.15	500	0.2	0.2495	0.1833	0.3858	37.48	−0.488	45.36
12	498.15	600	0.7	0.2667	0.1899	0.4201	35.32	0.095	44.24
13	573.15	300	1.7	0.2378	0.1965	0.3816	37.49	−0.784	45.19
14	573.15	400	1.2	0.2385	0.2056	0.3659	34.75	−2.110	43.96
15	573.15	500	0.7	0.2320	0.2103	0.3773	37.00	−0.558	44.88
16	573.15	600	0.2	0.2590	0.1968	0.3870	36.77	−0.428	45.15

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