Fig. 1
From: Wafer-scale radio frequency ZnO Schottky diodes and arithmetic circuits

Fabrication and characterisation of asymmetric electrode nanogap Schottky diodes. a, Process steps used to fabricate the ZnO Schottky diodes based on Al and Au coplanar nanogap electrodes: (1) Deposition of the ODPA SAM on top of a patterned Al electrode, (2) blanket thermal evaporation of Au across the entire substrate, (3) nanogap development by removing the Au layer from areas where it overlaps with the Al/ODPA electrodes via dipping in hot NMP, (4) SAM removal by brief exposure to argon plasma, (5) the empty Al-Au nanogap electrodes, (6) ZnO deposition onto the nanogap electrodes via sequential spin coating and thermal annealing. b, SEM top-view image of a representative Al-Au nanogap. c, High-resolution TEM cross-sectional view of the Al-Au nanogap revealing a ≈15 nm inter-electrode distance. d, Photography of a 4-inch glass wafer containing NGE-based ZnO Schottky diodes and circuits. The inset shows a zoomed image of a discrete interdigitated NGE-based ZnO diode.