Fig. 8

Cohesive delamination of SiCN thin film during nanoindentation test a (i) no delamination, and (ii) with delamination, and b Load-displacement curve with and without a cohesive interface.
Cohesive delamination of SiCN thin film during nanoindentation test a (i) no delamination, and (ii) with delamination, and b Load-displacement curve with and without a cohesive interface.