Table 3 Chemical composition of the electroless Cu plating bath and plating conditions.

Copper (II) sulfate pentahydrate, CuSO₄ 5H₂O

0.036 M

Glyoxylic acid, C₂H₂O₃

0.2 M

Ethylenediaminetetraacetic acid (EDTA), C₁₀H₁₆N₂O₈ 2,2^®-Bipyridyl, C₁₀H₈N₂

0.06 M

10 ppm

Sodium hydroxide, NaOH

Proper amount (to adjust pH)

Bath pH

12.2–12.4 @ 28 °C

Bath temperature

80–85 °C