Table 1 Optimized pastes for each G/CB ratio used.

From: Development and characterization of carbon-based conductive pastes with high mechanical integrity under bending stress for room-temperature printable electronics

G/CB

C (%)

R (Ω cm)

1

11.50

0.261 ± 0.018

2

11.50

0.121 ± 0.001

3

11.50

0.089 ± 0.006

4

11.50

0.078 ± 0.003

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