Table 1 Summary of material parameters for 2D and 3D elastodynamic finite integration technique (EFIT) simulations44,74,75,76

From: Fast in-line failure analysis of sub-micron-sized cracks in 3D interconnect technologies utilizing acoustic interferometry

Material

Young’s Modulus (GPa)

Poisson’s ratio

Mass density (kg m−3)

Silicon

130

0.28

2330

SiO2

70

0.19

2200

W

405

0.28

18250

SiN

140

0.27

3185

Sapphire

345

0.29

3980

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