Table 1 Comparison of MRAM, RRAM, and PCM. Note that main advantages and key challenges are based on ref. 55
Technology | Main advantages | Key challenges | PPA (power, performance, area) metrics | Near term potential | Long term potential |
|---|---|---|---|---|---|
MRAM | ● High performance ● Well-understood physics ● Novel mechanisms (e.g., SHE, VCMA) to extend capabilities | ● Reducing IC/Δ(power-stability tradeoff) ● Fabrication cost | ● Good power ● Excellent performance ● Ok area | ● High-endurance embedded memory | ● Cache memory ● High-performance/high-endurance in-memory computing |
RRAM | ● Simplicity and cost ● High density ● Versatile materials, structures, and behaviours | ● Reliability ● Variations | ● Good power ● Good performance ● Excellent area | ● Low-cost high-density embedded memory | ● High-density on-chip memory ● Low-cost in-memory computing |
PCM | ● Maturity ● Proven performance | ● Reliability ● Disturbance ● High switching power | ● Ok power ● Good performance ● Excellent area | ● Embedded memory | ● High-density on-chip memory |
