Fig. 1: Sketch of the hybrid photonic chip.
From: Telecom wavelength quantum dots interfaced with silicon-nitride circuits via photonic wire bonding
On the left (in green), the InAs/GaAs platform is shown with the AlAs/GaAs DBRs and the microlenses above the quantum dot layer. On the right (in blue), the Si3N4-based platform with the corresponding fabricated beamsplitter is depicted. Both platforms are connected by the laser written photonic wire bonds. The top excitation of the QDs is also visualized.
