Table 2 Properties of bulk SAC305 solder

From: Iterative printing of bulk metal and polymer for additive manufacturing of multi-layer electronic circuits

Property

Value

Manufacturer

Tamura ELSOLD

Melting point (solidus/liquidus)

217/220 °C

Density

7.38 g/cm3

Electrical conductivity

0.132 μΩ ⋅ m

Thermal conductivity

58 W/m ⋅ K

Coefficient of thermal expansion

23.5 × 10−6 m/m ⋅ K

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