Table 1 TDoE #1 Experimental Structure and Extent of Nitriding

From: Strength and thermal shock resistance of porous reaction-bonded silicon nitride by direct nitriding of binder jet additively manufactured silicon

Experiment

Time (h)

Temp (°C)

N2 flow rate (sccm)

Extent nitridation

1

4

1390

100

3.99%

2

4

1400

250

9.18%

3

4

1410

400

24.09%

4

8

1390

400

4.03%

5

8

1400

100

13.13%

6

8

1410

250

43.91%

7

12

1390

250

21.18%

8

12

1400

400

31.24%

9

12

1410

100

54.23%