Figure 5
From: Metal hierarchical patterning by direct nanoimprint lithography
Transfer imprinting of Pd lines to flexible polycarbonate (PC) substrate.
Cross-section SEM images of the 2 µm Pd gratings (a) as-imprinted and (b) after heat treatment, with magnified views in the insets. (c) Pd lines transferred to PC substrate and (d) cross-sectional view showing a partially embedded Pd line into PC substrate (at a SEM tilt angle of 60°). The sample was coated with Au to avoid surface charging while imaging in SEM. (e–h) Optical micrographs of the Pd lines embedded inside PC substrate. Images taken while different planes of the substrate were in optical focus, from top surface to the bottom surface of the PC. Arrow marks indicate the dust particle as an identification marker. (i) I-V characteristics of Pd lines in PC while bending to various angles, with the inset showing a digital photograph of the PC substrate with Pd lines at a bend angle of 60°. The resistance of Pd lines at a bend angle of 60° for various cycles of (j) tensile and (k) compressive strain.
