Figure 2
Microstructure characterization.
(a), (b), Top-view and cross-sectional SEM images of S/NP copper with a characteristic length of ~50 nm. (c), (d), (e), Low-magnification, top-view and cross-sectional SEM micrographs of S/NP Cu/MnO2 after electroless plating. (f), Bright-field HRTEM image of the S/NP Cu/MnO2 hybrid. The hybrid nanostructure can be identified by the contrast between the bright MnO2 filler and the dark copper ligament. (g), XPS spectrum of Mn-2p orbit for the MnO2 incorporated into S/NP Cu sheet. (h), Raman spectrum of S/NP Cu/MnO2 hybrid bulk electrode.
