Figure 2
AMCP test structure, interface board and test setup.
(a) A test structure with 21 independent AMCPs—the dark squares in the middle of the structure—vertically integrated on chromium anodes. On either side of the central rectangular area, which corresponds to the full deposited stack, the a-Si:H is progressively etched until the bonding pads are reached. (b) A test structure connected via aluminum wires to the interface board for electrical testing. (c) Schematic representation of the testing configuration inside a vacuum vessel. UV photons enter in vacuum vessel through a quartz window and are converted into photoelectrons the 16 nm-thick gold photocathode evaporated on quartz. The photoelectron screen prevents the parasitic photoelectron absorption by the bonding wires. The tilting rod prevents non-converted photons from reaching the a-Si:H decoupling layer and interfering with the electron multiplication measurements.
