Figure 1 | Scientific Reports

Figure 1

From: Maskless inverted pyramid texturization of silicon

Figure 1

A photo of Cu-NPs-assisted etching process and SEM images.

(a) 156 mm × 156 mm c-Si wafers being etched in a Cu(NO3)2/HF/H2O2/H2O etching bath. (b) SEM top-view image of the inverted pyramid arrays for 15 min processing. (c) Magnified SEM top-view image of an individual inverted pyramid processed for 15 min. (d) SEM cross-sectional view of an individual inverted pyramid processed for 15 min.

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