Figure 1

Morphology evolution of the sample surface exposed by (a–e) fs single pulse at a fluence of 9.46 J/cm2, (f–j) fs double pulses at a fluence of 9.46 J/cm2, pulse delay of 350 fs and energy distribution ratio of 1:1, (k–o) fs double pulses at a fluence of 5.30 J/cm2, pulse delay of 350 fs and energy distribution ratio of 1:1, at different stages of the etching process, where te represents the chemical etch time (min). The SEM images have varying scale bars.