Figure 5

The relationship between the etch rate and the pulse energy distribution ratio.
The total fluence is fixed at 9.46 J/cm2, the pulse delay is 350 fs and the etch time is 90 min.

The relationship between the etch rate and the pulse energy distribution ratio.
The total fluence is fixed at 9.46 J/cm2, the pulse delay is 350 fs and the etch time is 90 min.